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About Company
Quality & Environment Concept
Environmental
 
 
 
  About Company
 
Company History
  「SiBASE」was founded in 1997, the capital is NT$ 3 million. On June 2000 , the SiBASE was changed to 「SiBASE Technology Co., Ltd.」and the capital is up to NT$15 million. We invited professional person to join our group and focus on Wafer Saw and Wafer Grinding.
 
Operational goals
1.Professional Wafer Saw:
Our engineering background can reduce the yield loss.
2.Professional Wafer Grinding:
This service of 5 inch , 6 inch , 8 inch and 12 inch is shortly and stable.
3.Professional Die Sorting:
We have mapping and BIN sorting services by machine.
4.Professional Die Separation:
Using the professional machine to improve the yield.
5.Engineering Services:
To provide the Multi-Chip and COB services.
 
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